- Brand : DELL
- Product family : PowerEdge
- Product name : T140+634-BSFZ
- Product code : 8T0R6+634-BSFZ
- Category : Server
- Data-sheet quality : created/standardized by Icecat
- Product views : 26342
- Info modified on : 10 Mar 2024 10:10:44
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Short summary description DELL PowerEdge T140+634-BSFZ server 1 TB Tower Intel® Xeon® E-2124 3,3 GHz 8 GB DDR4-SDRAM 365 W Windows Server 2019 Essentials
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DELL PowerEdge T140+634-BSFZ, 3,3 GHz, E-2124, 8 GB, DDR4-SDRAM, 1 TB, Tower
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Long summary description DELL PowerEdge T140+634-BSFZ server 1 TB Tower Intel® Xeon® E-2124 3,3 GHz 8 GB DDR4-SDRAM 365 W Windows Server 2019 Essentials
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DELL PowerEdge T140+634-BSFZ. Keluarga prosesor: Intel® Xeon®, Frekuensi prosesor: 3,3 GHz, Model prosesor: E-2124. Memori internal: 8 GB, Tipe memori internal: DDR4-SDRAM, Tata letak memori (slot x ukuran): 1 x 8 GB. Total kapasitas penyimpanan: 1 TB, Ukuran harddisk: 3.5", Antarmuka harddisk: Serial SATA. Ethernet LAN. Tipe drive optikal: DVD-RW. Penyuplai daya: 365 W. Sistem operasi yang terpasang: Windows Server 2019 Essentials. Tipe sasis: Tower
Embed the product datasheet into your content
| Prosesor | |
|---|---|
| Produsen prosesor | Intel |
| Keluarga prosesor | Intel® Xeon® |
| Model prosesor | E-2124 |
| Frekuensi prosesor | 3,3 GHz |
| Frekuensi pendorong prosesor | 4,3 GHz |
| Inti prosesor | 4 |
| Cache prosesor | 8 MB |
| Chipset papan induk | Intel C246 |
| Jumlah prosesor yang terpasang | 1 |
| Thermal Design Power (TDP) | 71 W |
| Tipe cache Prosesor | Smart Cache |
| Kecepatan bus sistem | 8 GT/dt |
| Soket prosesor | LGA 1151 (Soket H4) |
| Litografi prosesor | 14 nm |
| Thread prosesor | 4 |
| Modus pengoperasian prosesor | 64-bit |
| Bus type | DMI3 |
| Nama kode prosesor | Coffee Lake |
| Tjunction | 100 °C |
| Memori internal maksimal yang didukung oleh prosesor | 128 GB |
| Jenis memori didukung oleh prosesor | DDR4-SDRAM |
| Kecepatan jam memori didukung oleh prosesor | 2666 MHz |
| Bandwith memori didukung oleh prosesor (maks) | 41,6 GB/d |
| Bit Nonaktif Eksekusi | |
| Keadaan Diam | |
| Teknologi Monitor Termal | |
| Jumlah maksimal jalur Ekspres PCI | 16 |
| Konfigurasi PCI Express | 1x16, 2x8, 1x8+2x4 |
| Ukuran paket prosesor | 37.5 x 37.5 mm |
| Set instruksi yang didukung | AVX 2.0, SSE4.1, SSE4.2 |
| Skalabilitas | 1S |
| Pilihan Tertanam Tersedia | |
| Memori | |
|---|---|
| Memori internal | 8 GB |
| Tipe memori internal | DDR4-SDRAM |
| Slot memori | 4x DIMM |
| ECC | |
| Kecepatan memori | 2666 MHz |
| Tata letak memori (slot x ukuran) | 1 x 8 GB |
| Memori internal maksimal | 64 GB |
| media penyimpanan | |
|---|---|
| Total kapasitas penyimpanan | 1 TB |
| Jumlah hard drisk yang terpasang | 1 |
| Kapasitas harddisk | 1 TB |
| Antarmuka harddisk | Serial SATA |
| Kecepatan Hard drive | 7200 RPM |
| Ukuran harddisk | 3.5" |
| Jumlah harddisk yang didukung | 4 |
| Ukuran harddisk yang didukung | 3.5" |
| Dukungan RAID | |
| Tipe drive optikal | DVD-RW |
| Antarmuka drive penyimpan didukung | SAS, Serial SATA |
| Grafik | |
|---|---|
| Model adaptor grafis pada papan induk | Tidak tersedia |
| Jaringan | |
|---|---|
| Ethernet LAN | |
| Tipe antarmuka ethernet | Gigabit Ethernet |
| Port & antarmuka | |
|---|---|
| Soket LAN ethernet (RJ-45) | 2 |
| Jumlah soket USB 2.0 | 4 |
| Kuantitas port Tipe A USB 3.2 Gen 1 (3.1 Gen 1) | 3 |
| Jumlah soket VGA (D-Sub) | 1 |
| Port & antarmuka | |
|---|---|
| Jumlah port serial | 1 |
| Slot ekspansi | |
|---|---|
| Slot PCI Express x1 (Gen 3.x) | 1 |
| Slot PCI Express x8 (Gen 3.x) | 2 |
| Slot PCI Express x16 (Gen 3.x) | 1 |
| Versi slot PCI Express | 3.0 |
| Desain | |
|---|---|
| Tipe sasis | Tower |
| Warna produk | Hitam |
| Performa | |
|---|---|
| Adminstrasi jarak jauh | iDRAC9 Basic |
| Perangkat lunak | |
|---|---|
| Sistem operasi yang terpasang | Windows Server 2019 Essentials |
| Sistem operasi yang kompatibel | - Microsoft Windows Server with Hyper-V - Red Hat Enterprise Linux - SUSE Linux Enterprise Server - VMware ESXi - Citrix XenServer - Ubuntu Server - Certify XenServerf |
| Fitur khusus prosesor | |
|---|---|
| Konfigurasi CPU (maks) | 1 |
| Teknologi SpeedStep Intel® yang diperbaharui | |
| Intel® Virtualization Technology untuk Directed I/O (VT-d) | |
| Teknologi Intel® Hyper Threading (Intel® HT Technology) | |
| Teknologi Intel® Turbo Boost | 2.0 |
| Instruksi Baru AES Intel® (Intel® AES-NI) | |
| Teknologi Eksekusi Terpercaya Intel® | |
| Intel® Enhanced Halt State | |
| Intel® VT-x dengan Tabel Halaman Ekstensi (EPT) | |
| Intel® Secure Key | |
| Intel® TSX-NI | |
| Intel® Penjaga OS | |
| Ekstensi Penjaga Perangkat Lunak Intel® (Intel® SGX) | |
| Intel® 64 | |
| Intel Secure Key Technology version | 1,00 |
| Teknologi Virtualisasi Intel® (VT-x) | |
| Versi TSX-NI Intel® | 1,00 |
| ID ARK prosesor | 134856 |
| Daya | |
|---|---|
| Dukungan redundant power supply (RPS) | |
| Penyuplai daya | 365 W |
| Sejumlah dukungan data utama | 1 |
| Frekuensi masuk penyuplai daya | 50 - 60 Hz |
| Operational conditions | |
|---|---|
| Suhu pengoperasian (T-T) | 10 - 35 °C |
| Suhu penyimpanan (T-T) | -40 - 65 °C |
| Rentang kelembapan pengoperasian (H-H) | 10 - 80 persen |
| Kelembapan relatif penyimpanan (H-H) | 5 - 95 persen |
| Ketinggian operasi | 0 - 3048 m |
| Ketinggian saat tidak beroperasi | 0 - 12000 m |
| Berat dan dimensi | |
|---|---|
| Panjang | 175 mm |
| Lebar | 454 mm |
| Tinggi | 360 mm |
| Panjang kemasan | 572 mm |
| Lebar kemasan | 505 mm |
| Tinggi kemasan | 394 mm |
| Berat kemasan | 15,4 kg |
| Isi kemasan | |
|---|---|
| Kabel disertakan | AC |