- Brand : HP
- Product name : Intel Xeon Gold 6144
- Product code : 3BA12AA
- GTIN (EAN/UPC) : 0192545309523
- Category : Processors
- Data-sheet quality : created/standardized by Icecat
- Product views : 56686
- Info modified on : 09 Mar 2024 14:26:42
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Long product name HP Intel Xeon Gold 6144 processor 3.5 GHz 24.75 MB L3
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Intel Xeon Gold 6144, 24.75M Cache, 3.5 GHz, 150 W TDP, FCLGA3647
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HP Intel Xeon Gold 6144 processor 3.5 GHz 24.75 MB L3
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Bring digital content creations to life with the reinvented Intel® Xeon® Scalable processors[1], available in four feature configurations—Platinum, Gold, Silver, and Bronze—to address your specific workstation deployment in VR and AR, content creation, CAD, and simulations.
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Short summary description HP Intel Xeon Gold 6144 processor 3.5 GHz 24.75 MB L3
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HP Intel Xeon Gold 6144, Intel® Xeon® Gold, LGA 3647 (Socket P), 14 nm, 3.5 GHz, 64-bit, 1st Generation Intel® Xeon® Scalable
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Long summary description HP Intel Xeon Gold 6144 processor 3.5 GHz 24.75 MB L3
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HP Intel Xeon Gold 6144. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: S4S. Package width: 399 mm, Package depth: 203 mm, Package height: 156 mm
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor model | 6144 |
| Processor base frequency | 3.5 GHz |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor series | Intel Xeon Gold 6000 Series |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.2 GHz |
| Processor cache | 24.75 MB |
| Processor cache type | L3 |
| Thermal Design Power (TDP) | 150 W |
| Cooler included | |
| Stepping | H0 |
| Bus type | UPI |
| Processor codename | Skylake |
| Memory | |
|---|---|
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | |
| Graphics | |
|---|---|
| On-board graphics card | |
| Discrete graphics card | |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| Features | |
|---|---|
| Execute Disable Bit | |
| Market segment | Server |
| Maximum number of PCI Express lanes | 48 |
| Features | |
|---|---|
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | |
| HP segment | Business |
| Processor special features | |
|---|---|
| Intel® Hyper Threading Technology (Intel® HT Technology) | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | |
| Enhanced Intel SpeedStep Technology | |
| Intel Trusted Execution Technology | |
| Intel® Speed Shift Technology | |
| Intel VT-x with Extended Page Tables (EPT) | |
| Intel TSX-NI | |
| Intel 64 | |
| Intel Virtualization Technology (VT-x) | |
| Intel Virtualization Technology for Directed I/O (VT-d) | |
| Intel Turbo Boost Max Technology 3.0 | |
| Intel® Optane™ Memory Ready | |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® vPro™ Platform Eligibility | |
| Operational conditions | |
|---|---|
| Tcase | 75 °C |
| Packaging data | |
|---|---|
| Package width | 399 mm |
| Package depth | 203 mm |
| Package height | 156 mm |
| Country | Distributor |
|---|---|
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3 distributor(s) |
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2 distributor(s) |